Map
Connect your IoT & M2M Devices Globally
Top Connect enables M2M connectivity by combining 350+ providers into a single global, mobile network.

SIM cards are available in three form factors: 2FF, 3FF, 4FF

2FF (mini SIM)

25mm x 15mm x 0.76mm
(0.984″ x 0.590″ x 0.029″)

3FF (micro SIM)

25mm x 15mm x 0.76mm
(0.984″ x 0.590″ x 0.029″)

4FF (nano SIM)

25mm x 15mm x 0.76mm
(0.984″ x 0.590″ x 0.029″)


MFF2 UICC (chip SIM)

Chip format SIMs are available in MFF2 (SON-8) package. UICC (chip SIM) can be soldered directly onto the circuit board during the device manufacturing process.Embedded SIMs improve security of M2M devices by limiting the replacement of the connectivity provider.

MFF2 (UICC/eUICC)

6mm × 5mm × 0.9 mm
(0.236″ x 0.196″ x 0.035″)


Embedded-SIM/embedded universal integrated circuit card (eUICC) – Electronic SIM profile

eUICC can be implemented in MFF2 chips or in plastic SIM cards. eSIM solution follows a new GSMA standard, that allows electronic profile delivery over the air (OTA). Top Connect provides turn-key eSIM solutions (SMDP/SMSR/OTA) for partners willing to develop a product based on this new and very effective technology.