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Top Connect Will Launch an eSIM

Top Connect, provider of world’s leading alternative roaming service TravelSIM with more than 5 million users worldwide, announced today the successful testing of geo-redundant eSIM platform to reduce roaming charges for customers.

FEBRUARY 21, 2019 (TALLINN, ESTONIA) – Top Connect, provider of world’s leading alternative roaming service TravelSIM with more than 5 million users worldwide, announced today the successful testing of geo-redundant eSIM platform to reduce roaming charges for customers.

Top Connect is developing geo-redundant universal embedded-SIM (eSIM) platform designed for the next generation of consumer wireless devices and for wireless machine-to-machine (M2M) communication as well.

According to Tarmo Osman, COO of Top Connect Ltd, eSIM will be available for Travelsim and other mobile roaming services offered by Top Connect during second half of 2019.

“Changing your mobile roaming provider while abroad will be new normality, as for example our alternative roaming services enable travellers to save up to 85% on roaming costs. As eSIM can be downloaded and installed to your mobile phone shortly before business or leisure trip without need to change your regular SIM card, it makes significant savings quicker and easier than never before,” says Osman.

eSIM technology is developed under specification of the GSMA which enables remote SIM provisioning of any mobile device. eSIM allows consumers to store multiple operator profiles on a device simultaneously and switch between them remotely.

eUICC-compliant (Embedded Universal Integrated Circuit Card) solution for wireless M2M communication allows companies to build a new range of products for global deployment based on this common embedded SIM architecture with remote SIM provisioning.

eSIM requires to use special devices with embedded-SIM compatibility. Currently eSIM technology is supported by limited range of phone models, but it grows rapidly. The commercial details of Top Connect eSIM and related services will be published in this summer.